To allow real-time control of dielectric chemical mechanical planarization (CMP) processes to the 45 nm device node and beyond, Santa Clara, Calif.-based semiconductor manufacturing equipment leader ...
For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP ...
The semiconductor industry is constantly marching toward thinner films and complex geometries with smaller dimensions, as well as newer materials. The number of chemical mechanical planarization (CMP) ...
Electronic and computer processors with a higher speed need smaller features for integrated circuits (IC), which also need smoother and smaller substrate surfaces. Chemical mechanical polishing (CMP) ...
The following column was provided by Drew Chambers, product manager for Rodel Inc., a Phoenix-based supplier of polishing pads for chemical mechanical planarization (CMP) applications. Chemical ...
Chemical mechanical polishing (CMP) is a process of global planarization that leverages the synergetic effect of chemical reactions and mechanical abrasion to facilitate wafer polishing. CMP has ...
Machine learning (ML), neural networks (NNs), and deep learning have many applications in different areas of modern industry and life. Their ability to “learn” how to analyze and predict imprecise ...
Suppliers of chemical mechanical planarization (CMP) slurries may be fierce competitors of Cabot Microelectronics, the company considered to be the sector's number one player, but they agree with the ...
Geneva, June 15, 2011 - STMicroelectronics (NYSE: STM) and CMP (Circuits Multi Projets®) today announced that the CMOS 28nm process from STMicroelectronics is now available for prototyping to ...