The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...
Lapping plates conditioned with the FastLap facing device produce more consistent surface finishes and more predictable removal rate, improving quality and lowering overall production cost. A new ...
SAN JOSE, Calif., Feb. 23, 2011 /PRNewswire/ -- Novellus Systems announced today that its subsidiary Peter Wolters GmbH has introduced a new version of its microLine double side lapping system for ...
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