A key element of Mitsubishi’s new forged molding compound (FMC) carbon fiber-reinforced SMC is the use of low-flow (but not low-pressure) compression molding, which ...
System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...
The new composites are designed as alternatives to thermoset sheet molding compounds (SMCs). Offering similar mechanical performance, they are much more ductile and, as thermoplastic systems, much ...
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