TE Connectivity recently unveiled its extra-large array (XLA) socket technology, which provides more reliable performance with 78% better warpage control than traditional molded socket technologies.
Harrisburg, PA. TE Connectivity (TE) has introduced its new extra-large array (XLA) socket technology, which provides more reliable performance with 78% better warpage control than traditional ...
Shrinking pitches, smaller solder balls and higher integrated-circuit speeds are driving the biggest advances in ball grid array (BGA) and chip-scale package (CSP) socket technology for burn-in, test ...
GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative ...
Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...
Presenting the new, .050” (1,27 mm) pitch solder cup headers and sockets for termination of fine gauge wires and cables. These solder cup connectors are ideal for applications that demand a highly ...
DENVER--(BUSINESS WIRE)--Xtremity, a premium medical device maker known for developing cutting-edge prosthetic thermoformable socket technology and the creator of the XtremityTT™ Socket System, today ...
DENVER--(BUSINESS WIRE)--Xtremity, a premium medical device maker known for developing cutting-edge prosthetic thermoformable socket technology and the creator of the XtremityTT™ Socket System, today ...
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