The kind of lapping plate Insaco uses plays a vital role in the lapping process. It significantly affects the output of this abrasive machining technique. A plate should not be too hard as it damages ...
The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...
Lapping plates conditioned with the FastLap facing device produce more consistent surface finishes and more predictable removal rate, improving quality and lowering overall production cost. A new ...
Sponsored by Vitrek, LLCReviewed by Maria OsipovaSep 18 2025 Wafer lapping is a vital semiconductor thinning operation that requires precise control to avoid over-removal of material, which can result ...
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